Best Practice Guide for Thermocycling and Reliability Assessment of Solder Joints
نویسندگان
چکیده
This guide recommends best practice used for short-term accelerated thermal cycling as a method for assessing solder joint reliability. Three techniques (shear testing, and electrical continuity measurements, complemented with microstructural investigations) are described. NPL Report CMMT(A)274 © Crown copyright 2000 Reproduced by permission of the Controller of HMSO
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